Microelectronics technology:  Polymers for advanced imaging and pakaging 
Elsa Reichmanis; Christhoper K. Ober; Scott A. MacDonald (Eds.) 
 - xii; 563 p. 
 - ACS Symposium 614 .
<br/><br/> BIBLIOTECA: UACH-FCQ 
<br/><br/><label>ISBN: </label>0-8412-3332-2 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Ingenieria electronica--Empacamiento
<br/><br/><label>Dewey Class. No.: </label>621.381046  / REI 1995